Department of Materials Engineering, San Jose State University, San Jose, CA 95192.
Professor (Aug 1993 to present);
Associate Professor (Aug 1989 to Aug 1993);
Lecturer (Aug 1984 to Aug 1989)

Senior Materials Engineer, Scientific Service, Inc., 35 Arch Street, Redwood City, CA 94062. (Apr 1983 to Aug 1984)

Consultant Scientist, European Institute for Transuranium Elements, Karlsruhe, West Germany. (Aug 1980 to Feb 1983)

Lecturer, Department of Materials Engineering, San Jose State University, San Jose, CA 95192. (Jan 1978 to Jun 1980)

Design Engineer/Plant Engineer, Nippon Sheet Glass, Osaka, Japan. (Sept 1969 to May 1974)

April 2004	President's Scholar Award, SJSU
October 1997	Gold Award, California Emergency Services Association
April 1997	Excellence in Scholarship Award, College of Engineering, SJSU
June 1989	Meritorious Performance and Professional Promise Award, SJSU
June 1987	Meritorious Performance and Professional Promise Award, SJSU
August 1977	Passed Ph.D. Thesis Defense with distinction
September 1976	June 1977 Alice C. Steel Fellowship
July 1974 - June 1976	Fullbright-Hays Fellowship
April 1964 - March 1969	Japanese Government Scholarship

English, Japanese, German, Tamil and Malay.

Registered Professional Engineer, Metallurgical Engineering, California.
Registered Professional Engineer, Mechanical Engineering, Malaysia.
Member, American Society of Metals.
Member, Metallurgical Society of AIME.
Member, Earthquake Engineering Research Institute.
Member, California Emergency Services Association
Member, Phi Kappa Phi

Co-Chair, Disaster Resistant California 2003 Conference
Advisory Committee Member, Metropolitan Technology Center
Board Member, San Jose State University Foundation
Advisory Board Member, Chip Scale Review
Chair, US Organizing Committee, International Conference on Corporate Earthquake Programs
Member, Organizing Committee, Summit on Pb-Free Solder Implementation, MEPTEC
Instructor, Materials Issues in Semiconductor Packaging, IEEE-CPMT

LSI Logic Corporation - Failure Analysis of Electronic Components and Devices
Corporate Technology Center, United Defense - Failure Analysis of Electronic Components and Devices
Seagate Technology - Strength and Characterization of Glass Substrates
Adaptec - Failure Analysis of Electronic Components and Devices
The Pinson Institute - Curriculum Development in Electronic Materials
ChipPAC, Inc. - Encapsulation and Interconnection of Microelectronic Devices
Alza Corporation - Nonstructural hazard mitigation
Urban Safety Research Institute, Tokyo - Cost/Benefit analysis of risk reduction techniques
CTI Engineering, Tokyo - Earthquake hazard reduction
Western Digital Corporation - Corrosion of magnetic disk media, and Development of advanced magnetic disk substrates
KLA Instruments - Effect of deposition conditions on surface morphology of thin films
Association of Bay Area Governments - Special problems posed by hazardous materials during earthquakes