Materials Issues And Engineering Design Considerations for Device Packaging of High Power Edge Emitting Semiconductor Laser Arrays and Monolithic Stacked Laser Diode Bars, Rajan Bhatia.

  Material and Reliability Requirements for MEMS Packaging, Soheil Bigdeli.

  Materials Requirements for Optoelectronic Packaging - Fiber Soldering, Fahong Jin.

  Post Weld Disturbance Analysis in Laser Diode Assemblies, Paren Shah.

  Understanding and Minimization of Tin Whiskers, Qian Sun.

  Analysing Backside Chipping Issues of the Die at Wafer Saw, Martin Vagues.

  Silver Migration - The Mechanism and Effects on Thick-Film Conductors, Kim Vu.

  Corrosion in Microelectrionics, Chongchen Xu.

  Study of Copper Applications and Effects of Copper Oxidation in Microelectronic Package, Ying Zheng.