Guna S. Selvaduray
CME Department  
 

  1. Zheng, Y., G. Selvaduray and W. Loo, "Thickness Measurement of Diamond-Like Carbon by Auger Electron Spectroscopy," Manuscript in preparation for publication.

  2. Vukazich, S., G. Selvaduray and J. Tran, "Santa Clara County Soft First Story Multi Unit Building Survey," Submitted to Earthquake Spectra, Earthquake Engineering Research Institute, (September 2005)

  3. Selvaduray, G. and S. Trigwell, "Effect of Surface Treatment on Surface Characteristics of 316L Stainless Steel," Proceedings Materials and Processes for Medical Devices Conference, ASM International, Boston, Massachusetts. (November 14-16, 2005)

  4. Selvaduray, G., "Partnership Building for Disaster Mitigation: Collaboration among Government, Business and Academia," Proceedings International Workshop on Emergency Response and Rescue, National Council on Science and Technology for Disaster Reduction, Taipei, Taiwan. (October 31-November 1, 2005)

  5. Trigwell, S. and G. Selvaduray, "Effects of welding on the passive oxide film of electropolished 316L stainless steel,," Journal of Materials Processing Technology No. 166 p 30-43 (2005).

  6. Chang, W., D.-S Jiang and G. Selvaduray, "CSP Drop Test Performance Comparison for Different Solder Ball Materials," Proceedings IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, California. (April 2005)

  7. Selvaduray, G., "Protecting Laboratory Equipment by Implementing Nonstructural Hazard Mitigation," Seismic Design, Retrofit and Performance of Nonstructural Components in Critical Facilities, ATC-29-2, Applied Technology Council, Redwood City, California, (October, 2003)

  8. Selvaduray, G., and H. Bueno, "The Critical Surface Tension of 316L Stainless Steel: Implications for Stent Thrombogenicity," ", Proceedings ASM Materials and Processes for Medical Devices Conference, ASM International, Anaheim, California, September 8-10, 2003.

  9. Fariabi, S., Rooein M. and Selvaduray G., "Structure-Property-Processing Relationships of 316L Stainless Steel Hypotubing for Manufacturing of Intravascular Stents," Proceedings ASM Materials and Processes for Medical Devices Conference, ASM International, Anaheim, California, September 8-10, 2003.

  10. Selvaduray, G. and Becker J. F., "Development of Graduate Level Course on Packaging of Photonic and Optoelectronic Devices," Proc. 53rd Electronic Components and Technology Conference, IEEE-CPMT, New Orleans, May 25-27, 2003.

  11. Vukazich, S., Selvaduray G., Tran J, and S. Arnold, "Santa Clara County Soft First-Story Multi-Family Building Survey," Disaster Resistant California 2003 Conference, San Jose, California, April 21 ?23, 2003.

  12. Chan, M., D. Lau, J. K. Ng and Selvaduray G., "Effects of Applied Plastic Film on Dispersion Characteristics of Glass Shards during In-Plane Racking," Proc. Disaster Resistant California 2003 Conference, San Jose, California, April 21-23, 2003.

  13. Chan, H. A., Selvaduray G., and Becker J. F., "Requirements of Advanced Packaging Curriculum," Proceedings of the 4th International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and Micro-systems, Aix-en-Provence, France, March 30 - April 2, 2003, pp. 155-160.

  14. Selvaduray G., "Utilization of Pb-free solders in MEMS Packaging," in SPIE Proceedings on Reliability, Testing, and Characterization of MEMS/MOEMS, R. Ramesham and D. Tanner, Eds., 2003, Vol 4980, pp. 268 - 274.

  15. Trigwell S. & Selvaduray G., "Effects of welding electropolished 316L stainless steel as used in ultra-pure fluid delivery systems for the semiconductor and pharmaceutical industries," Journal of the Arkansas Academy of Science, Vol. 56, (2003)

  16. Selvaduray G., "Hazardous Materials: Earthquake Caused Incidents and Mitigation Approaches," in Earthquake Engineering Handbook, W. F. Chen and C. Scawthorn, Eds., CRC Press, 2002, pg. 30-1, pg.30-29.

  17. Becker, J. and Selvaduray G., "Optoelectronics Packaging Education at San Jose State University," 2nd Annual IEEE Photonic Devices and Systems Packaging Symposium Proceedings, Stanford, California, July 2002. p 117-121.

  18. Selvaduray, G., McMullin K., Arnold S. and Brindos R., "Nonstructural Hazard Mitigation Retrofit of an Engineering Laboratory at San Jose State University," Proceedings of the Seventh National Conference on Earthquake Engineering, Boston, Massachusetts, July 2002.

  19. Selvaduray, G., Lee W. and Yee S., "Fluxless Soldering: A Review," Microelectronic Packaging, 2001, Vol. 1, pp 289-304.

  20. Selvaduray, G., "Every Problem Presents an Opportunity," Guest Editorial, MEPTEC Report, pg. 34, (July/August 2000).

  21. Turn, J. C., Selvaduray G., Vukazich S. and Amoukteh P., "Analysis of a PBGA Board Interconnect Failure," Proceedings 3rd Semiconductor Packaging Symposium, San Jose, California, (July 2000).

  22. Abtew, M. and Selvaduray G., "Lead-Free Solders in Microelectronics," Materials Science & Engineering Reports, Vol R27, Nos 5-6, June 1, 2000.

  23. Selvaduray, G, "Recyclability of Microelectronic Systems," Advances in Packaging Development and Research, Edited by J.A. Marcondes, (June 2000) pp 450 - 460.

  24. Selvaduray, G, "Sintered Architectural Glass Tiles from Recycled Glass," Advances in Packaging Development and Research,, Edited by J.A. Marcondes, (June 2000) pp 461 ?467.

  25. Tojima, K. and Selvaduray G., "Wetting Force of Lead-Free Solders on Bare Copper and Ni-Pd Coated Copper," Proceedings International Conference on High Density Interconnect and Systems Packaging, Denver, Colorado, (April 2000) pp 585 ?591.

  26. Selvaduray, G., "Lead-Free Manufacturing ?An Expert Looks at the Issues," Chip Scale Review,, March-April 2000. (New)

  27. Lee, W., Nguyen L.T. and Selvaduray G., "Solder Joint Fatigue Models ?Review and Applicability to Chip Scale Packages," Microelectronics Reliability, 40 (2000), pp 231-244.

  28. Reitherman, R., Selvaduray G., Ino M. and Vukazich S., "Earthquake Protection for Businesses," Proceedings 12th World Conference on Earthquake Engineering, Auckland, New Zeland, (Jan 2000)

  29. Abtew, M. and Selvaduray G., "Lead-Free Solders for Surface Mount Technology Applications," ChipScale Review, Vol. 2, No. 4, September 1998, pp 29-38.

  30. Nguyen, L.T., C.G. Quentin, N. Kelkar and Selvaduray G., "Wafer Level Application of Reworkable Underfill," Proceedings of iMAPS '99, Chicago, USA, October, 1999.

  31. Dugbartey, N., D. Tovar and Selvaduray G., "Temperature Dependence of Contact Angle of Silicone Encapsulant," Proceedings of iMAPS '99, Chicago, USA, October, 1999.

  32. Nguyen, L.T., J. Song, A. Prabhu, I. Singh and Selvaduray G., "Wirebond Integrity for Ultra Fine Pitch Devices," Proceedings of iMAPS '99, Chicago, USA, October, 1999.

  33. Nguyen, L.T., W. Lee, N. Kelkar and Selvaduray G., "Solder Joint Fatigue Model for the mSMD Wafer Level Chip Scale Package," Proceedings of iMAPS '99, Chicago, USA, October, 1999.

  34. Selvaduray, G., "Transforming the Mechanical Engineering Curriculum to meet the Challenges of the 21st Century," Invited paper for the Journal of the Japan Society of Mechanical Engineering, November, 1998.

  35. Selvaduray, G., "Effect of the Hanshin-Awaji Earthquake on Manufacturing Industries," Proceedings of the Sixth National Conference on Earthquake Engineering, EERI, Oakland, California, May 1998.

  36. Selvaduray, G., "Earthquake Caused Hazardous Materials Incidents at Educational Facilities", Seismic Design, Retrofit and Performance of Nonstructural Components, Applied Technology Council, Redwood City, California, (January 1998)

  37. Trigwell, S., R. Hayden, K. Nelson and Selvaduray G., "Effects of Treatment on the Surface Chemistry of NiTi Shape Memory Alloys", Journal of Surface and Interface Analysis, June, 1997.

  38. Selvaduray, G., "Occurrence of Hazardous Materials Incidents during the Northridge Earthquake of January 17, 1994", Proceedings of the Northridge Earthquake Research Conference, CUREe, Los Angeles, California, August 21, 1997.

  39. Brindos, R., and Selvaduray G., "Effect of Temperature on Wetting Angle", National Educators' Workshop: Update 96 - Standard Experiments in Engineering Materials Science and Technology, NASA Publication 3354, July 1997. pp 137-151.

  40. Thomas, S., E. Hasenkamp and Selvaduray G., "Determination of Oxygen Diffusion in Ionic Solids", The Journal of Materials Education, Vol 19, No. 3, pp 213-215.

  41. Hilden, J., K. Lewis, A. Meamaripour and Selvaduray G., "Measurement of Springback Angle in Sheet Bending", The Journal of Materials Education, Vol. 19, No. 3, pp 185-198.

  42. Chao, J., S. Curotto, C. Anderson and Selvaduray G., "The Effect of Surface Finish on Tensile Strength", The Journal of Materials Education, Vol. 19, No. 3, pp 199-212.

  43. Selvaduray, G. and F. Barez, "Microelectronic Packaging Curriculum Development at San Jose State University", Proceedings of the 47th IEEE Electronic Components and Technology Conference, San Jose, California, (May 18-21, 1997)

  44. Selvaduray, G., W. Lee and S. Yee, "Effect of Surface Treatment on the Wetting Force of Eutectic Pb-Sn Solder on Copper Substrates", Design and Reliability of Solder Joints and Interconnects, R. K. Mahidhara, et al. Ed., TMS, Pennsylvania, (1997), pp 259-266.

  45. Trigwell, S., and Selvaduray G., "Effects of Surface Finish on the Corrosion of NiTi Alloy for Biomedical Applications", Proceedings of the Second International Conference on Shape Memory and Superelastic Technologies: Engineering and Biomedical Applications, Pacific Grove, California, (March 2-6, 1997)

  46. Selvaduray, G., "The Significance of Corporate Earthquake Programs - Similarities and Differences between Japan and the U.S.A.", Journal of The Japan Society of Mechanical Engineers, Vol. 99, No. 935, (October 1996), pp 863-866. (Invited paper, in Japanese)

  47. Trigwell, S., Selvaduray G. and A. Singh, "Effects of Intermetallic Compound Formation on the Electrical Performance of Wirebonded Interconnects", Intl. J. of Microcircuits and Electronic Packaging, Vol. 19, No. 1, First Quarter 1996. pp 14-21.

  48. Barez, F., Selvaduray G. and R. Agarwal, "Electronic and Microelectronic Packaging Curriculum Development at San Jose State University", Proc. INTERPACK '95, American Society of Mechanical Engineers, Honolulu, Hawaii, March 1995.

  49. Selvaduray, G., "Environmental Integration and Technologies", Advanced Manufacturing: Technology and International Competitiveness, UCRL-ID-120595, Feb 1995.

  50. Selvaduray, G., "Undergraduate Engineering Ceramics Laboratory Development", International Journal of Engineering Education, Vol. 11, No. 4-5, (1995) pp 374-379.

  51. Eslamy, M. and Selvaduray G., "Polymers in Microelectronics Packaging: Challenges and Trends", Proceedings International Seminar of Polymer Science and Technology, Shiraz, Iran, May 2-4, 1994.

  52. Selvaduray, G. and A. Singh, "Modeling of Flip-Chip-Bonded and Wire-Bonded MCM Interconnects for Electrical Performance Comparison", Intl. J. of Microcircuits and Electronic Packaging, Vol. 17, No. 1, First Quarter 1994. pp 14-21.

  53. Abtew, M. and Selvaduray G., "Solder Wicking in Surface Mount Vapor Phase Reflow Processes", Proc. 8th International Electronic Materials & Processes Conference, ASM International, San Jose, California, August 1993. pp 151-156.

  54. Aggarwal, I. and Selvaduray G., "Role of CuxSny Intermetallics in the Reliability of Controlled Collapsed Chip Connection (C4)", Proc. 8th International Electronic Materials & Processes Conference, ASM International, San Jose, California, August 1993. pp 75-82.

  55. Selvaduray, G. and L. Sheet, "Aluminum Nitride: A Review of Synthesis Methods", Materials Science and Technology, June 1993, Vol. 9, pp 463-473.

  56. Selvaduray, G. and C. Lomax, "Fusible Heat Sink Materials: An Evaluation of Alternatives", Proc. 22nd International Conference on Environmental Systems, SAE International, Seattle, WA July 13-16, 1992.

  57. Selvaduray, G. "Laboratory Developments in Engineering Ceramics", 1992 ASEE Annual Conf. Proc., June 21-25, 1992. Toledo, OH. pp 469-474.

  58. Selvaduray, G., C. Zhang, et al, "Effect of CO2 on the Processing of Y-Ba-Cu-O Superconductors", Journal of Materials Research, Vol. 7, No. 2, Feb 1992, pp. 283-291.

  59. Selvaduray, G., E. Wyatt and J. Perkins, "Analysis of Hazardous Materials Releases during the Loma Prieta Earthquake", Proc. 3rd US-Japan Workshop on Urban Earthquake Hazards, EERI, Honolulu, Hawaii, November 13-15, 1991.

  60. Perkins, J., W. Wyatt and Selvaduray G., Toxic Gas Releases in Earthquakes: Existing Programs, Sources and Mitigation Strategies, Association of Bay Area Governments, Nov 1991.

  61. Selvaduray, G., "Corporate Earthquake Programs - Differences and Similarities between the U.S.A. and Japan", Proc. First US-Japan Conf. on Corporate Earthquake Programs, Sept 24-26, 1991, San Jose, California.

  62. Selvaduray, G., "Materials Selection Parameters for Ceramic Substrates: Property-Processing Relationships", Materials Developments in Microelectronic Packaging: Performance and Reliability, P. Singh, Ed., ASM International, (1991) pp 29-35.

  63. Selvaduray, G. and C. Lomax, "Fusible Heat Sink Materials: An Identification of Alternatives", Proc. 21st International Conference on Environmental Systems, SAE International, San Francisco, California. July 15-18, 1991.

  64. Balachandran, U., D. H. Xu, Selvaduray G., et al, "Characterization of YBCO Superconductors Sintered in CO2-Containing Atmospheres", Ceramic Transactions, Vol. 18, 1991. pp 341-355.

  65. Selvaduray, G., D. Richard, D. Quinn, and D. Rowland, "Relationship Between Microstructure and Physical Properties of Al2O3 and SiC Reinforced Aluminum Alloys", Interfaces in Metal Ceramics Composites, R.Y. Lin, et al, Eds., TMS, (1990) pp 271 - 289.

  66. Selvaduray, G. and L. Martinez, "Thin Alumina Coatings on Borosilicate Glass: Interfacial Interactions During Heat Treatment", Interfaces in Metal Ceramics Composites, R.Y. Lin, et al, Eds., TMS, (1990) pp 137 - 150.

  67. Balachandran, U., D. H. Xu, Selvaduray G. et al, "Degradation of Properties of YBa2Cu3Ox Superconductors Sintered in CO2-Containing Atmosphere", Proc. Fourth Ann. Conf. on Superconductivity and Applications, Buffalo, NY, September 18-20, 1990.

  68. Selvaduray, G. "Reducing Earthquake Caused Damage at Industrial Facilities", Proc. 1st National Conference of DRP 2000, American Defense Preparedness Association, April 10-11, 1990, Los Angeles, CA. pp 56 - 67.

  69. Selvaduray, G., "Earthquake Hazard Reduction in the Laboratory", Proc. HAZMACON 89, Santa Clara, California, April 18 - 20, 1989.

  70. Selvaduray, G., M. B. Lange and D. Sullivan, "Chemical Characterization of Ceramic Substrates for Microelectronic Packaging", Proc. Symp. on Adv. Characterization Techniques for Ceramics, Electronics Division of The American Ceramic Society, San Francisco, (Oct. 1988).

  71. Selvaduray G. and R. Reitherman, "Private Sector Earthquake Programs in Japan and the United States", Proc. 9th World Conf. on Earthquake Engr., Tokyo, Japan. (Aug 1988).

  72. Selvaduray, G., "Hazardous Materials Issues in Earthquake Emergency Response", Proc. Second U.S.-Japan Workshop on Urban Earthquake Hazards, Shimizu, Japan. (Jul 1988).

  73. Selvaduray G. and M. B. Lange, "Ceramic Microchip Packages: Materials Selection Parameters", Proc. Ceramic Substrates and Packages, An International Symposium, Electronics Division of The American Ceramic Society, Inc. Denver, (Oct 1987).

  74. Selvaduray, G., "Die Bond Materials and Bonding Mechanisms in Microelectronic Packaging", Thin Solid Films, 153, (1987).

  75. Selvaduray, G., "Earthquake Hazard Reduction at Japanese Petroleum Production Facilities", Proc. Third U.S. Conf. on Earthquake Engineering, Charleston, S.C., (Aug 1986).

  76. Selvaduray, G., "Development of Earthquake Hazard Reduction Equipment in Japan", Proc. Third U.S. Conf. on Earthquake Engineering, Charleston, S.C., (Aug 1986),

  77. Selvaduray, G., "Industrial Uses for Liquid Tin", Tin International, (May 1985).

  78. Selvaduray, G., "Industrial Earthquake Preparedness in Shizuoka and the Role of the Prefectural Government", Earthquake Spectra, Vol. 1, No. 2, pp 307-318, EERI, Berkeley, Calif. (Feb 1985).

  79. Selvaduray, G., "Liquid Tin as a Solvent Metal and Reaction Medium", Tin and Its Uses, No. 141, pp. 12-13. (1984).

  80. Selvaduray, G., "Earthquake Emergency Preparedness in Japan", People and National Land Policy, Vol. 10, No. 3, pp. 24-29. (Sept 1984) (Japanese).

  81. Selvaduray, G., "Pyrometallurgical Reprocessing of Carbide Breeder Fuels", Proc. Int. Meeting on Fuel Reprocessing and Waste Management, American Nuclear Society, Wyoming. (Aug 1984).

  82. Selvaduray, G., "Decontamination Requirements for FBR- and LWR- Derived Pu", Trans. Am. Nuclear Soc. 1983 Winter Meeting, San Francisco. (Nov 1983).

  83. Selvaduray, G., "The Liquid Tin Process: An Experimental Investigation of a Potential Pyrometallurgical Process for Reprocessing Irradiated Carbide Fuels for Fast Breeder Reactors", European Appl. Res. Rept. - Nucl. Sci. Tech., Vol. 4, No. 6, pp. 1451-1514. (1983).

  84. Ohto, T. and Selvaduray G., "Effect of Backup Roll Length and Roll Neck Length on Profile for 4-h Mills", Iron and Steel Engineer, Vol. 58, No. 3, pp. 60-65. (Mar 1981).

  85. Selvaduray, G., "Interim Report on Dissolution of Uranium Carbide in Liquid Tin", Commission of the European Communities, Joint Research Center, Karlsruhe Establishment, Technical Report K 0280042. (Dec 1980).

  86. Anderson, R. N. and Selvaduray G., "Thermodynamics of Ti-Sn Alloys", Proc. 4th Intl. Titanium Conf., Kyoto, Japan. (May 1980).

  87. Selvaduray, G., M. Goldstein and R. N. Anderson, "Review of Reprocessing Technologies", Conservation and Recycling, Vol. 3, pp. 93-134. (Dec 1979).

  88. Selvaduray, G. and M. Goldstein, "Internationally Safeguarded Atomic Fuel Exchange Center for the Asia Pacific Basin", Proc. 2nd Miami Intl. Conf. on Alternate Energy Sources, Miami, Florida. (Dec. 1979).

  89. Anderson, R. N., Selvaduray G. and M. Goldstein, "Nuclear Reactors Capable of In-Situ Reprocessing", Proc. 2nd. Miami Intl. Conf. on Alternate Energy Sources, Miami, Florida. (Dec. 1979).

  90. Selvaduray, G., and L. Heising, "Proliferation Resistant Reprocessing Methods", Nuclear Engineering International, Vol. 24, No. 292. (Nov 1979).

  91. Selvaduray, G., M. Goldstein and R. N. Anderson, "Finding a Site to Store Spent Fuel in the Pacific Basin", Nuclear Engineering International, Vol. 24, No. 290, pp. 44-47. (Sept 1979).

  92. Anderson, R. N. and Selvaduray G., "The Effect of Pressure Interface Interactions between Solids", Proc. Conf. on High-Level Radioactive Waste Forms, Denver, Colorado. NUREG/CP-005, pp. 317-338. (Dec 1978).

  93. Selvaduray, G., R. N. Anderson and M. Goldstein, "Separation Technologies Reviewed", Nuclear Engineering International, Vol. 23, No. 275, pp. 35-40. (Aug 1978).

  94. Selvaduray, G., "Comparative Evaluation of Nuclear Fuel Reprocessing Technologies for Advanced Fuel Cycle Concepts", Ph. D. Thesis, Department of Applied Earth Sciences, Stanford University, California. (Mar 1978)

  95. Goldstein, M., Selvaduray G. and R. N. Anderson, "Methodology for Comparative Evaluation of Nuclear Fuel Reprocessing Techniques for Advanced Low Proliferation Risk Fuel Cycles", Proc. Intl. Conf. on Alternative Energy Sources, Miami, Florida. (Dec 1977).

  96. Goldstein, M., Selvaduray G. and R. N. Anderson, "Reprocessing Technologies for Alternate Fuel Cycles", Proc. Intl. Sci. Forum on an Acceptable Nuclear Energy Future of the World, Miami, Florida. (Nov 1977).

  97. Goldstein, M., Selvaduray G. and R. N. Anderson, "Methodology for the Evaluation of Alternate Technologies Applied to Nuclear Fuel Reprocessing", Brookhaven National Laboratory Report No. BNL-50700.

  98. Goldstein, M., Selvaduray G. and R. N. Anderson, "Waste Management and Proliferation: An Assessment of Technologies and Policies Relevant to Nuclear Power", Brookhaven National Laboratory Report No. BNL-50694. (Mar 1977).

  99. Goldstein, M., Selvaduray G. and R. N. Anderson, "Survey of Reprocessing Technologies", Brookhaven National Laboratory Report No. BNL-23083R.


Proceedings Edited

Proceedings of the Disaster Resistant California 2003 Conference, San Jose, California, April 2003.


Proceedings of the Fifth International Conference on Corporate Earthquake Programs, San Jose, California, November, 2000.


Proceedings of the Third US-Japan Conference on Corporate Earthquake Programs, San Jose, California, November, 1996.