Description: Advanced Stent Development, Advanced Cardiovascular Systems, Inc.
Description: Alternate Lead Free Alloys, SJSU Foundation
Description: Characterization of Glass Substrates for Hard Drive Applications, Seagate Technology
Description: Collaborative for Disaster Mitigation Implementation Grant, Federal Emergency Management Agency
Description: College of Engineering Recognition Award, SJSU College of Engineering
Description: Computer Modeling of Solder Joint Fatigue Life for μSMD Structures, National Semiconductor Corporation
Description: Corrosion Evaluation of Heat Exchanger Tubing, Pacific Gas & Electric Company
Description: Corrosion Testing of Condenser Tube Materials at Geysers Power Plant, Pacific Gas & Electric Company
Description: Design and Prototype Construction of Sorting Table, Franchise Tax Board, California
Description: Development of Business Continuity Plan, SJSU Foundation
Description: Development of Cost/Benefit Analysis Methodologies for Hazard Mitigation Projects, Federal Emergency Management Agency
Description: Development of Guide Wires for Angioplasty, Advanced Cardio-vascular Systems, Inc.
Description: Development of Processing Techniques for Advanced Thermal Protection Materials, NASA-Ames Research Center, Thermal Protection Materials Branch
Description: Disaster Resistant California Conference, FEMA
Description: Earthquake Caused Hazardous Materials Incidents, U.S. Department of Interior, U.S. Geological Survey
Description: Earthquake Hazard Mitigation, California Office of Emergency Services
Description: Effect of Geometry on Solder Joint Reliability for Leadless Leadframe Packages, National Semiconductor Corporation
Description: Effect of Processing Parameters on Strength of Silicon Dies, LSI Logic, Inc.
Description: Effect of Thermal Processing on Microstructure of Ball Grid Arrays, Solectron Corporation
Description: Evaluation of Sterilization Techniques, Guidant Corporation
Description: Extraction Table Design and Prototype Development, Franchise Tax Board
Description: Field Emission Breakdown of High-Voltage Insulation Devices, Communications & Power Industries, Inc.,
Description: Fluxless Soldering for Microelectronic Packages, Solectron Corporation
Description: Hazard Mitigation Implementation for Small Businesses, FEMA
Description: Hazardous Materials Incidents During Earthquakes: Japan's Experience and Solutions, National Science Foundation
Description: Homeowners Guide to Seismic Safety, California Seismic Safety Commission
Description: Inventory of Soft First Story Multi-Family Dwellings in Santa Clara County, Santa Clara County, Emergency Preparedness Council
Description: Investigation of Solder Mask Cracking, LSI Logic
Description: Magnetic Recording Head Contamination Research, Akashic Memories Corporation
Description: Nonstructural Earthquake Hazard Mitigation, California Emergency Medical Services Agency
Description: Nonstructural Earthquake Hazard Mitigation, Emergency Medical Services Agency, California
Description: NSF Instrumentation and Laboratory Improvement Program in Microprocessor and Intelligent Control Applications (Co-Principal Investigator), National Science Foundation
Description: Packaging of Microelectronic Devices: Short Courses for Undergraduate Faculty Enhancement, National Science Foundation
Description: Radio Frequency Vapor Deposition of Diboride Compounds on Ceramic Fibers, NASA-Ames, Thermal Protection Materials Branch
Description: Recyclability of Multi-Material Durable Goods, City of San Jose
Description: Recycled Glass: Development of Market Potential, City of San Jose
Description: Recycled Glass: Process Development for Sintered Glass Architectural Tiles, City of San Jose
Description: Screen Printing of Wafer Level Underfill, National Semiconductor Corporation
Description: Signal Speed Comparison of Flip-Chip and Wire-Bonded Multichip Modules, Lockheed Corporation
Description: Sol-gel Synthesis of Borosilicate Glass, ISHM Educational Foundation
Description: Thermal Conductivity of Interlaced Two Phase Systems for Fusible Heat Sink Applications, NASA-Ames, Life Sciences Division
Description: Tingle Table II Construction, Franchise Tax Board
Description: Tingle Table II Construction, Franchise Tax Board
Description: Utilizing Relational Databases for Materials Properties, WhoWhere, Inc.
Description: Wire Bond Integrity for Fine Pitch Devices, National Semiconductor Corporation
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