ME 146 Thermal Management of Electronics

Note that it's been a few years since this class has been taught, so the presentations are not completely up-to-date.

Administration

Other Resources

Powerpoint Presentations

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Why Thermal Management?

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Overview of Temperature Measurement

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Fan Performance

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Where is Heat Generated?

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Heat Sink Selection

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Thermal Interface Materials

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Constriction and Spreading Resistance

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Simplified Thermal Stress Analysis

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Liquid Cooling of Electronics

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Lead-Free Electronics

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Jedec Standards

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Heat Pipes

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Thermoelectric Coolers

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Vapor Compression Systems

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Nanoscale Heat Transfer

Lab/Activity Materials

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Thermocouple Construction and Calibration

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Fan Performance and Chassis Impedance        Wind Tunnel CFM plots    Lab Data

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Computer Chassis Cooling

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Project Specifications

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Flotherm Tutorial version 1

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Flotherm Project

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Heat Sink Performance Testing  

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Heat Pipes Part 1        EES Code for orifice plate

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Heat Pipes Part 2 (Laptop Cooling)

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Thermoelectric Cooling   

Homework

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Homework 1  Overview of Thermal Resistance Method  Solution part a Solution part b (solving for Tj)

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Homework 2  Calculating Heat Sink Flow Bypass   Solution

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Homework 3  Heat Sink Performance    Solution

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Homework 4  Constriction/Spreading Resistance    Solution

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Homework 5 Thermal Stress Analysis    Solution 
    Bottom number on solution that is cut off is 1.66 x 104 psi

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Homework 6 Natural Convection/Radiation Solution

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Homework 7 Forced Convection  Solution

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Homework 8 Liquid Flow in Microchannels  Solution

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Homework 9 Boiling Heat Transfer  Solution