1987 Publications

by BCME Faculty and Students

  1. Selvaduray G. and M. B. Lange, "Ceramic Microchip Packages: Materials Selection Parameters", Proc. Ceramic Substrates and Packages, An International Symposium, Electronics Division of The American Ceramic Society, Inc. Denver, (Oct 1987).
  2. Selvaduray, G., "Die Bond Materials and Bonding Mechanisms in Microelectronic Packaging", Thin Solid Films, 153, (1987).