by BCME Faculty and Students
- Selvaduray, G. and A. Singh, "Modeling of Flip-Chip-Bonded and Wire-Bonded MCM Interconnects for Electrical Performance Comparison", Intl. J. of Microcircuits and Electronic Packaging, Vol. 17, No. 1, First Quarter 1994. pp 14-21.
- Aggarwal, I. and G. Selvaduray, "Role of CuxSny Intermetallics in the Reliability of Controlled Collapsed Chip Connection (C4)", Proc. 8th International Electronic Materials & Processes Conference, ASM International, San José, California, August 1993. pp 75-82.